Thanks for dropping in. I appreciate your kind words and your addition to this thread.
If you are with IBM in Florida, you might be in Boca Raton, yes?
I remember when industry experts were saying the one micron was the limit in photolithography. This was before some very clever people descended into the deep UV realm, and other technologies. As you know, once you go beyond deep UV, you are soon into soft X-rays, and all the associated problems. One way or another, Gordon Moore's law is still alive.
Direct write E-beam was discusssed some years back, but I haven't heard the term in quite a while. While the feature size is smaller, the write-time factor was the problem. Do you have any recent news of that technology?
While on my stroll down memory lane, what happened to gallium-arsenide technology? When I was active in semiconductor technology (early to mid-1990s) it was still a bit tricky getting the components to play nice together.
In addition to the copy stand mentioned earlier, I have the 1.4, 1.7, and 2.0 teleconverters. Next time I photograph the wafers I will use the stand and the teleconverters and see what occurs. The image above was a quick and dirty table-top session using a small RRS tripod, the wafer propped up on a book, and a pair of SB-R200 speedlights for illumination.
HBB in Phoenix, Arizona Nikonian Team Member
Photography is a journey with no conceivable destination.